The MECHANIC XGZ40 Solder Paste Flux is a premium-grade soldering material designed for SMD, BGA, and PCB rework applications. This high-performance solder paste ensures strong, reliable solder joints with excellent wettability and smooth flow. It is made from a Sn63/Pb37 alloy (63% tin, 37% lead), ensuring consistent melting performance at 183°C, making it ideal for professional electronics repair, mobile phone PCB soldering, and DIY electronic projects.

Its squeeze tube with needle design allows for precise application, minimizing waste and providing clean, controlled solder placement on fine-pitch components. Perfect for technicians, repair shops, and electronics engineers who require high-quality soldering results.

Features:

• High-quality Sn63/Pb37 solder alloy ensures stable and strong solder joints.

• Melting point of 183°C allows for smooth and fast soldering.

• Designed for SMD, BGA, and PCB rework applications.

• 35g tube with 10cc volume – convenient for long-term use.

• Squeeze tube with needle tip enables precise and clean dispensing.

• Excellent flux performance (IPX3) for improved solder flow and reduced oxidation.

• Ideal for mobile phone PCB repair, circuit rework, and fine-pitch soldering.

• Smooth consistency for easy application and minimal residue.

• Micron size 20-38u ensures even solder distribution and consistent joint quality.

• Suitable for DIY, repair labs, electronics workshops, and industrial soldering work.

Specifications:

• Material: Tin + Flux Solder Paste

• Type: BGA Soldering Tin Cream

• Product Model: XG-Z40

• Alloy Composition: Sn63/Pb37

• Volume: 10CC

• Weight: 35g

• Melting Point: 183°C

• Design: Squeeze Tube with Needle Dispense

• Micron Size: 20–38u (3# Grade)

• Flux Type: IPX3

• Application: SMD, BGA, PGA, PCB Rework, Phone PCB Repair

• Function: Soldering, Rework, Protection for Electronic Components

How to Use:

• Clean the PCB surface and components before applying solder paste.

• Dispense a small amount of MECHANIC XGZ40 solder paste onto the target area using the needle tip.

• Position components onto the solder paste accurately.

• Heat the solder joints using a hot air rework station or soldering iron until the solder melts and forms a solid connection.

• Allow to cool and inspect the joints for uniform bonding.

• Clean any residual flux with isopropyl alcohol for a professional finish.

Applications:

• PCB Repair and Rework: Perfect for repairing damaged traces and joints on mobile phone PCBs and small circuit boards.

• SMD Soldering: Enables smooth soldering for fine-pitch SMD components with strong bonding.

• BGA and PGA Reballing: Delivers precise control and quality results for advanced chip soldering and reballing tasks.

• Electronic Device Maintenance: Essential for repairing smartphones, tablets, laptops, and other digital devices.

• Prototype Assembly: Great for circuit testing and prototyping during development stages.

• DIY Electronics Projects: Reliable and easy to use for hobbyists and learners working on electronic kits or repair tasks.

• Professional Workshop Use: Trusted by electronics technicians for efficient, consistent soldering results on all circuit types.

Product Benefits:

• Provides excellent solder joint strength and durability.

• Minimizes oxidation and reduces bridging between pads.

• Maintains consistent solder flow even on fine-pitch pads.

• Reduces the risk of cold joints and incomplete wetting.

• Compatible with various reflow and manual soldering processes.

• Improves electrical conductivity and reliability of soldered connections.

Storage and Handling:

• Store in a cool, dry place (below 25°C) away from direct sunlight.

• Keep the tube tightly sealed when not in use.

• Avoid contamination by not touching the needle tip directly.

• Recommended to use within 6–12 months of opening for best results.

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