HY510/ HM501 Silicone Thermal Paste 20ml is a high-performance thermal grease designed for efficient heat transfer between electronic components and heatsinks. This premium silicone-based thermal compound is widely used for CPU, GPU, VGA graphics cards, LED chips, ICs, power modules, and other heat-generating components in computers and electronic devices.

With high thermal conductivity above 1.93 W/m·K and very low thermal resistance, HY510 ensures fast and stable heat dissipation, helping to extend component lifespan and maintain optimal performance. The paste is electrically non-conductive, non-corrosive, non-toxic, and safe for beginners and professionals. Its smooth consistency allows easy application and long-term durability without drying or cracking.

Features:

• High-performance silicone thermal paste for efficient heat transfer

• Thermal conductivity greater than 1.93 W/m·K

• Low thermal resistance for faster heat dissipation

• Electrically non-conductive and metal-safe

• Non-toxic, tasteless, and non-corrosive formulation

• Stable and long-lasting performance without drying

• Easy to apply with smooth and uniform consistency

• Suitable for CPU, GPU, VGA, LED, IC, and power components

• Wide operating temperature range for extreme environments

• Reliable solution for professional and DIY electronics cooling

Specifications:

• Model: HM501/ HY510

• Color: Grey

• Weight / Volume: 20ml

• Thermal Conductivity: > 1.93 W/m·K

• Thermal Impedance: < 0.225

• Specific Gravity: > 2.0

• Viscosity: 1000

• Thixotropic Index: 380 ±10

• Operating Temperature Range: -30°C to 300°C

• Working Viscosity Range: -50°C to 300°C

• Silicone Compounds: 50%

• Carbon Compounds: 30%

• Metal Oxide Compounds: 20%

• Material Type: ISOL 6 Heat Sink Compound

• Electrical Conductivity: Non-conductive

• Chemical Property: Non-corrosive, non-curing

• Package Size: Approx. 30 × 36 × 27 mm

How to Use

• Clean the CPU, GPU, or heatsink surface using alcohol or cleaning solution

• Ensure the surface is dry and free from dust or oil

• Apply a small drop of thermal paste at the center of the surface

• Spread evenly using a spatula or finger cover

• Recommended layer thickness is approximately 0.13–0.15 mm

• Mount the heatsink carefully and apply even pressure

• Avoid removing the heatsink after installation to prevent air bubbles

Application Areas

• CPU and processor cooling systems

• GPU and VGA graphics cards

• LED chips and LED heat sinks

• Power supply units and voltage regulators

• ICs, chipsets, and semiconductor devices

• Laptop and desktop computers

• Network and communication equipment

• Power conversion equipment

• Automotive electronic control modules

• High-power LED lighting systems

• Household and industrial electronic devices

Safety and Usage Notes

• Keep out of reach of children

• Do not ingest or allow contact with eyes

• Avoid direct hand contact during application

• Store in a cool, dry place

• Close the cap tightly after use to prevent drying

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